|
Range
|
Item
|
Sample batch Capa
|
Small batch Capa
|
|
Normal
|
Layers Count
|
≦108L
|
≦46L
|
|
Board Thickness
|
0.2~13.0mm
|
0.4~6.5mm
|
|
Thickness Tolerance
|
±8%
|
±10%
|
|
Impedance Tolerance
|
Differential impedance≥50Ω
|
±8%
|
±10%
|
|
Characteristic impedance ≤50Ω
|
±2.5Ω
|
±5Ω
|
|
Warpage(Min)
|
≦0.3%
|
≦0.75%
|
|
Stack up
|
PP Thickness
|
≧3mil
|
≧3mil
|
|
Drilling
|
Min Drilling diameter
|
0.125mm
|
0.15mm
|
|
Hole diameter tolerance
|
PTH
|
±0.04mm
|
±0.05mm
|
|
NPTH
|
±0.025mm
|
±0.05mm
|
|
Plating
|
Aspect Ratio of Plated Hole(Max)
|
30:1
|
25:1
|
|
Line Design
|
Inner Layer
|
Layers: 4-10L
|
≥5.5mil
|
≥6.5mil
|
|
Layers: 12-36L
|
≥7mil
|
≥7mil
|
|
Inner Layer Line Width/Space
|
Inner Layer HOZ
|
2.0mil/2.0mil
|
3mil/3mil
|
|
Max Base Copper
|
Inner Layer
|
28OZ
|
6OZ
|
|
Outer Layer
|
28OZ
|
6OZ
|
|
Outer Layer Line Width/Space
|
30-40um
|
3/3mil
|
3/3mil
|
|
40-55um
|
3.5/3.5mil
|
4/4mil
|
|
總銅:40~55um
|
3.5/3.5mil
|
4/4mil
|
|
Line width tolerance
|
Width≥10mil
|
±15μm
|
±1mil
|
|
Width<10mil
|
±10%
|
±10%
|
|
Pad Tolerance
|
Pad≥12mil
|
±1mil
|
±1mil
|
|
Solder Mask
|
Solder Mask Bridge
|
3.5mil
|
4mi
|
|
S/M Plugging
|
Plugging diameter hole
|
5mil
|
5mil
|
|
S/M Thickness
|
Line to surface
|
10~40μm
|
10~40μm
|
|
Line to corner
|
≧5μm
|
≧5μm
|
|
Routing
|
Tolerance
|
±0.1mm
|
±0.1mm
|
|
Surface Treatment
|
Gold-plated plug
|
Gold thickness
|
0.127~2μm
|
0.127~1.25μm
|
|
Ni thickness
|
2.54~6μm
|
2.54~6μm
|
|
ENIG
|
Gold thickness
|
0.03~0.2μm
|
0.03~0.2μm
|
|
Ni thickness
|
2.54~6μm
|
2.54~6μm
|
|
OSP
|
Film thickness
|
0.2~0.6μm
|
0.2~0.6μm
|
|
HASL lead free
|
1~40μm
|
1~40μm
|
|
Immersion Silver
|
6~15u"
|
6~15u"
|
|
Immersion Tin
|
0.8~1.2μm
|
0.8~1.2μm
|
|
Gold Finger
|
Gold thickness
|
0.127-2μm
|
0.127-1.25μm
|
|
Length Tolerance (Etching)
|
±0.15mm
|
±0.15mm
|
|
Length Tolerance (Solder Mask)
|
±0.1mm
|
±0.1mm
|
|
Width Tolerance
|
±25μm
|
±40μm
|
Surface treatment: HASL lead free, immersion gold, immersion Tin, immersion Silver, Gold Finger, Hard/Soft gold plating, OSP, ENEPlG and Selective hard gold plating.
Materials:FR4, Rogers, Arlon, Taconic, Bergguist, TUC, Panasonic M6/M7 and so on.
Special technology:Blind & buried holes, Via in pad, Castellated holes, Counterbore, Step mounting holes, Controlled depth holes, edge-plating, metal base PCB, Stepped G/F, Back-drill, Mixed RF PCB, Busbar PCB, Copper coin embedded and Ceramic coin embedded.
